We used a SIGRAY Apex Hybrid machine to image a SAM4S target board. The focused area was sub-chip, but the entire board was in the machine. After imaging, the board no longer responds.
I did not operate the machine nor do I understand the possible configuration settings, so I don’t know the total ionizing dose. The target board was left idle after imaging for over 24 hours before powering it up, but was not subjected to any thermal cycle for post exposure annealing. But it’s possible that ESD killed the target. We don’t have any ESD control in our lab (yeah, don’t judge, i’m trying to fix that). But I was super careful and walked the target to and from the machine in an ESD bad, made sure the tech and I touched a grounding web in the machine before opening the bad, and minimized total touch time. But it’s still possible that ESD got it.
My question is, has anyone else had experience with killing a part or board after imaging, whether it be the SAM4S or any other device/board?